1 rectifier device data
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? current capacity comparable to chassis mounted rectifiers ? very high surge capacity ? insulated case mechanical characteristics: ? case: epoxy, molded ? weight: 2.5 grams (approximately) ? finish: all external surfaces corrosion resistant and terminal lead is readily solderable ? lead temperature for soldering purposes: 260 c max. for 10 seconds ? polarity: cathode polarity band ? shipped 1000 units per plastic bag. available tape and reeled, 800 units per reel by adding a arl'' suffix to the part number ? marking: r750, r751, r752, r754, r758, r760 maximum ratings characteristic symbol MR750 mr751 mr752 mr754 mr756 mr758 mr760 unit peak repetitive reverse voltage working peak reverse voltage dc blocking voltage v rrm v rwm v r 50 100 200 400 600 800 1000 volts nonrepetitive peak reverse voltage (halfwave, single phase, 60 hz peak) v rsm 60 120 240 480 720 960 1200 volts rms reverse voltage v r(rms) 35 70 140 280 420 560 700 volts average rectified forward current (single phase, resistive load, 60 hz) see figures 5 and 6 i o 22 (t l = 60 c, 1/8 lead lengths) 6.0 (t a = 60 c, p.c. board mounting) amps nonrepetitive peak surge current (surge applied at rated load conditions) i fsm 400 (for 1 cycle) amps operating and storage junction temperature range t j , t stg 65 to +175 c electrical characteristics characteristic and conditions symbol max unit maximum instantaneous forward voltage drop (i f = 100 amps, t j = 25 c) v f 1.25 volts maximum forward voltage drop (i f = 6.0 amps, t a = 25 c, 3/8 leads) v f 0.90 volts maximum reverse current t j = 25 c (rated dc voltage) t j = 100 c i r 25 1.0 m a ma designer's data for aworst caseo conditions e the designer's data sheet permits the design of most circuits entirely from the information presented. soa limit curves e representing boundaries on device characteristics e are given to facilitate aworst caseo design. preferred devices are motorola recommended choices for future use and best overall value. ? motorola, inc. 1996 order this document by MR750/d
semiconductor technical data high current lead mounted silicon rectifiers 501000 volts diffused junction case 19404 mr754 and mr760 are motorola preferred devices rev 2
2 rectifier device data figure 1. forward voltage figure 2. maximum surge capability figure 3. forward voltage temperature coefficient figure 4. typical transient thermal resistance 1.8 2.4 0.6 v f , instantaneous forward voltage (volts) 700 500 20 50 10 i f , instantaneous forward current (amp) 5.0 2.0 1.0 1.2 0.8 1.0 1.4 1.6 2.0 2.2 2.6 7.0 100 70 0.2 0.5 0.7 200 30 3.0 0.3 300 maximum typical t j = 25 c number of cycles at 60 hz 100 1.0 300 100 80 60 i 2.0 5.0 10 20 50 200 400 600 , peak half wave current (amp) fsm t j = 175 c 25 c v rrm may be applied between each cycle of surge. the t j noted is t j prior to surge i f , instantaneous forward current (amp) 1.0 0.2 +0.5 0 0.5 1.0 1.5 2.0 2.0 coefficient (mv/ c) 10 20 100 200 0.5 5.0 50 typical range t, time (seconds) 1.0 10 1.0 0.2 2.0 5.0 10 20 50 5.0 20 r 3.0 2.0 0.5 0.3 0.1 0.2 0.3 0.5 0.7 3.0 30 7.0 70 both leads to heat sink, with lengths as shown. variations in r jl(t) below 2.0 seconds are independent of lead connections of 1/8 inch or greater, and vary only about 20% from the values shown. values for times greater than 2.0 seconds may be obtained by drawing a curve, with the end point (at 70 seconds) taken from figure 8, or calculated from the notes, using the given curves as a guide. either typical or maximum values may be used. for r jl(t) values at pulse widths less than 0.1 second, the above curve can be extrapolated down to 10 m s at a continuing slope. thermal resistance ( c/w) 175 c 25 c 1/2o 3/8o 1/4o 1/8o , junctiontolead transient jl(t) q heat sink l l
3 rectifier device data figure 5. maximum current ratings t l , lead temperature ( c) 0 8.0 i f(av) 0 12 20 28 40 80 120 160 200 figure 6. maximum current ratings 0 8.0 4.0 0 16 24 32 i f(av) , average forward current (amps) p f(av) figure 7. power dissipation , power dissipation (watts) 5/8o , average forward current (amps) capacitance loads 8.0 12 16 resistive inductive loads t a , ambient temperature ( c) 0 1.0 i f(av) 0 2.0 3.0 4.0 40 80 120 160 200 figure 8. steady state thermal resistance f = 60 hz , average forward current (amps) resistive inductive loads capacitance loads 1 & 3 20 6 1 & 3 20 i avg t a(a) t a(k) t l(a) t c(a) t j t c(k) t l(k) p f r q s(a) r q l(a) r q j(a) r q j(k) r q l(k) r q s(k) use of the above model permits junction to lead thermal resistance for any mounting configuration to be found. lowest values occur when one side of the rectifier is brought as close as possible to the heat sink as shown below. terms in the model signify: t a = ambient temperature t c = case temperature t l = lead temperature t j = junction temperature r s = thermal resistance, heat sink to ambient r l = thermal resistance, lead to heat sink r j = thermal resistance, junction to case p f = power dissipation (subscripts a and k refer to anode and cathode sides, respectively.) values for thermal resistance components are: r l = 40 c/w/in. typically and 44 c/w/in maximum. r j = 2 c/w typically and 4 c/w maximum. since r j is so low, measurements of the case temperature, t c , will be approximately equal to junction temperature in practical lead mounted applications. when used as a 60 hz rectifierm the slow thermal response holds t j(pk) close to t j(avg) . therefore maximum lead temperature may be found from: t l = 175 r q jl p f . p f may be found from figure 7. the recommended method of mounting to a p.c. board is shown on the sketch, where r q ja is approximately 25 c/w for a 11/2o x 11/2o copper surface area. values of 40 c/w are typical for mounting to terminal strips or p.c. boards where available surface area is small. board ground plane recommended mounting for half wave circuit 24 28 32 0 1/4 5.0 0 1/2 3/4 1.0 l, lead length (inches) r jl , thermal resistance, single lead to heat sink, insignificant heat flow through other lead 10 15 20 25 30 35 40 24 16 4.0 20 60 100 140 180 4.0 12 20 28 1/8 3/8 5/8 7/8 q junctiontolead( c/w) both leads to heat sink with lengths as shown 3/8o 1/4o l = 1/8o 20 60 100 140 180 5.0 6.0 7.0 i (pk) = 5 i avg i (pk) = 10 i avg i (pk) = 20 i avg 10 i avg i (pk) = 5 i avg resistive inductive loads both leads to heat sink, equal length 6 (i pk /i ave = 6.28) see note r q ja = 40 c/w see note r q ja = 25 c/w notes thermal circuit model (for heat conduction through the leads)
4 rectifier device data figure 9. rectification efficiency figure 10. reverse recovery time repetition frequency (khz) 2.0 1.0 100 50 30 20 70 3.0 5.0 100 relative efficiency (%) 70 7.0 10 20 30 50 t j = 25 c current input waveform i r /i f , ratio of reverse to forward current 0.2 0.1 20 7.0 5.0 2.0 1.0 7.0 0.3 0.5 10 3.0 t rr , reverse recovery time ( s) 10 0.7 1.0 2.0 3.0 5.0 t j = 25 c i f = 5 a 3 a 1 a i f 0 i r t rr figure 11. junction capacitance figure 12. forward recovery time v r , reverse voltage (volts) 1.0 3.0 500 300 200 100 70 50 2.0 c, capacitance (pf) 10 20 100 7.0 5.0 50 30 t j = 25 c 1.0 i f , forward pulse current (amp) 0.7 0.5 0.3 0.2 0.1 2.0 , forward recovery time ( s) t fr 5.0 3.0 1.0 7.0 10 fr = 1.0 v t j = 25 c fr f t fr t j = 175 c 30 700 1000 30 20 10 70 fr = 2.0 v r s r l v o figure 13. singlephase halfwave rectifier circuit the rectification efficiency factor s shown in figure 9 was calculated using the formula: s p (dc) p (rms) v 2 o (dc) r l v 2 o (rms) r l . 100% v 2 o (dc) v 2 o ( ac) v 2 o (dc) . 100% (1) for a sine wave input v m sin (wt) to the diode, assumed lossless, the maximum theoretical efficiency factor becomes: s (sine) v 2 m 2 r l v 2 m 4r l . 100% 4 p 2 . 100% 40.6% (2) for a square wave input of amplitude v m , the efficiency factor becomes: s (square) v 2 m 2 r l v 2 m r l . 100% 50% (3) (a full wave circuit has twice these efficiencies) as the frequency of the input signal is increased, the re- verse recovery time of the diode (figure 10) becomes signifi- cant, resulting in an increasing ac voltage component across r l which is opposite in polarity to the forward current, there- by reducing the value of the efficiency factor s , as shown on figure 9. it should be emphasized that figure 9 shows waveform ef- ficiency only; it does not provide a measure of diode losses. data was obtained by measuring the ac component of v o with a true rms ac voltmeter and the dc component with a dc voltmeter. the data was used in equation 1 to obtain points for figure 9.
5 rectifier device data package dimensions case 19404 issue f notes: 1. cathode symbol on package. style 1: pin 1. cathode 2. anode a k b k 2 1 d dim min max min max inches millimeters a 8.43 8.69 0.332 0.342 b 5.94 6.25 0.234 0.246 d 1.27 1.35 0.050 0.053 e 25.15 25.65 0.990 1.010
6 rectifier device data motorola reserves the right to make changes without further notice to any products herein. motorola makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does motorola assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. atypicalo parameters which may be provided in motorola data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. all operating parameters, including atypicalso must be validated for each customer application by customer's technical experts. motorola does not convey any license under its patent rights nor the rights of others. motorola products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the motorola product could create a situation where personal injury or death may occur. should buyer purchase or use motorola products for any such unintended or unauthorized application, buyer shall indemnify and hold motorola and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that motorola was negligent regarding the design or manufacture of the part. motorola and are registered trademarks of motorola, inc. motorola, inc. is an equal opportunity/affirmative action employer. mfax is a trademark of motorola, inc. how to reach us: usa / europe / locations not listed : motorola literature distribution; japan : nippon motorola ltd.: spd, strategic planning office, 4321, p.o. box 5405, denver, colorado 80217. 13036752140 or 18004412447 nishigotanda, shinagawaku, tokyo 141, japan. 81354878488 customer focus center: 18005216274 mfax ? : rmfax0@email.sps.mot.com touchtone 1 6022446609 asia / pacific : motorola semiconductors h.k. ltd.; 8b tai ping industrial park, motorola fax back system us & canada only 18007741848 51 ting kok road, tai po, n.t., hong kong. 85226629298 http://sps.motorola.com/mfax/ home page : http://motorola.com/sps/ MR750/d ? codeline to be placed here
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